Certificate in Patterning for Semiconductor Devices

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The Certificate in Patterning for Semiconductor Devices course is a comprehensive program designed to equip learners with the essential skills necessary for success in the semiconductor industry. This course focuses on the critical area of patterning, which is a key enabler of Moore's Law and the development of advanced semiconductor devices.

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AboutThisCourse

In this course, learners will gain a deep understanding of the latest patterning technologies, including extreme ultraviolet lithography (EUVL) and multi-patterning techniques. They will also learn about the design, fabrication, and testing of semiconductor devices, as well as the challenges and opportunities associated with patterning at advanced nodes. With a strong emphasis on practical applications, this course is highly relevant to the needs of the semiconductor industry. It is ideal for engineers, researchers, and technologists who are seeking to advance their careers in this exciting and rapidly evolving field. By completing this course, learners will be well-positioned to make meaningful contributions to the development of next-generation semiconductor devices.

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• Introduction to Patterning for Semiconductor Devices: Basics of semiconductor device patterning, lithography techniques, and their importance. • Lithography Fundamentals: Photolithography, EUV (Extreme Ultraviolet) lithography, and their applications in semiconductor device manufacturing. • Resist Technologies: Positive and negative resists, deep ultraviolet (DUV) resists, chemically amplified resists, and their properties. • Patterning Processes: Lithography process steps, alignment, exposure, development, and etching techniques. • Multipatterning Techniques: Double/multiple patterning, quadruple patterning, and their advantages and challenges. • Patterning for 3D Structures: 3D NAND flash and FinFET patterning, 3D-Gate-All-Around (GAA) technology, and via reveal processes. • Patterning Quality Control: Critical dimension (CD) measurement, overlay metrology, defect inspection, and yield enhancement. • Patterning for Advanced Node Technologies: EUV lithography for 7nm and below technology nodes, self-aligned quadruple patterning (SAQP), and directed self-assembly (DSA). • Emerging Patterning Technologies: Nanoimprint lithography (NIL), directed self-assembly (DSA), and other next-generation patterning techniques.

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  • BasicUnderstandingSubject
  • ProficiencyEnglish
  • ComputerInternetAccess
  • BasicComputerSkills
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FastTrack GBP £140
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AcceleratedLearningPath
  • ThreeFourHoursPerWeek
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StandardMode GBP £90
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FlexibleLearningPace
  • TwoThreeHoursPerWeek
  • RegularCertificateDelivery
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CERTIFICATE IN PATTERNING FOR SEMICONDUCTOR DEVICES
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London School of International Business (LSIB)
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05 May 2025
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